Heat Sinks Heatspreader solution for conga-PA5 based on open silicon Pentium and Celeron processors . All standoffs are with 2.7 mm threaded hole.

33,750원

Interface Development Tools LVDS / DVI CONVERTER BOARD FOR FLAT PANEL

88,575원

Development Boards & Kits - x86 EVALUATION CARRIER BRD COM EXP TYPE 10

697,500원

Development Boards & Kits - x86 EVAL CARRIER BOARD COM EXPRESS TYPE 6

698,130원

Development Boards & Kits - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0

480,000원

Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

22,500원

Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.

16,875원

Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.

22,500원

Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.

73,125원

Development Boards & Kits - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No BMC. Commercial temperature range from -40 C to 85 C.

1,105,770원

Sockets & Adapters eDP to standard DisplayPort evaluation adapter for congatec Thin Mini-ITX boards

74,820원

CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

110,130원